Assembly & Packaging Service
Ph42 provides D&E photonics packaging and integration services with a proven state-of-the-art know-how and network access (supply chain, equipment suppliers, universities, and research institutes) gathered through the participation in European projects (FP7 and H2020 framework programs) and the team members’ backgrounds.
The know-how on photonic integration and packaging of components and modules based on Silicon Photonics and Indium Phosphide, as well as hybrid integration technology platforms, is being made available to both SME and large companies that operate in the photonics industry segment.
Ph42 offers custom packages to ensure the best performance, but also generic packages when cost efficiency is critical, typically for (early) prototyping and low volume. Ph42 has access to state-of-the-art industrial assets and equipment to cover assembly back-end processes of Photonic Integrated Circuits (PIC-) based devices.