Photonics 42 collaborates with ficonTEC Service GmbH for the development of VCSEL wafer-level testing solutions.
FiconTEC has contracted Photonics 42 with the development of an innovative multi-site Electro-Optical (e/o) Probe Head for high-throughput wafer-level VCSEL testing solutions. The parallel multi-point probe head is matched to COTS-based modular instrumentation to answer to the requirements of the VCSEL manufacturers’ high-volume testing demands, ultimately driven by high-tech and consumer markets.
The modularity and the scalability of the probing solution and the associate instrumentation will be considered among the premium KPIs of ficonTEC’s VCSEL automated testing machines. Photonics 42 will develop a family of modular e/o testing solutions ready for integration on a fully automated VCSEL wafer prober platform currently in development at ficonTEC. This initial project for high-volume testing applications kicks-off a long-term partnership between Photonics 42 and ficonTEC for the development of wafer-level automated testing tools and associated machine systems for both VCSELs and integrated photonic applications.
ficonTEC is a recognized market leader for automated assembly and testing systems for high-end photonic components, devices and PICs (photonics integrated circuits).
Considerable process capability and dedicated assembly technologies have been accumulated in serving the needs of a broad selection of industry segments – including telecom and datacom, high-power diode laser assembly, sensing from bio-med to automotive, micro-optics, and more. ficonTEC has consistently retained a unique modular approach to production equipment design. Today, with a globally installed base totaling over 700 machines, each one is the automated and optimized embodiment of a customer-defined process.